Shenzhen smart earphone FPC manufacturer

Classification of aluminum base plate: aluminum base copper clad plate is divided into three categories: one is the general aluminum base copper clad plate, the insulation layer is composed of epoxy glass cloth bonding sheet; The second is high heat dissipation aluminum base copper clad plate, the insulation layer is made of high thermal conductivity epoxy resin or other resin; The insulation layer is composed of polyolefin resin or polyimide resin glass cloth bonded sheet. Aluminum base copper clad plate and conventional FR-4 copper clad plate is a big difference in heat dissipation, compared with 1.5mm thickness OF FR-4 copper clad plate and aluminum base copper clad plate, the former thermal resistance 20~22, the latter thermal resistance 1.0~2.0, the latter is much smaller. Smart earphone FPC3, metal base: what kind of metal is used for insulating metal base plate depends on the thermal expansion coefficient of metal base plate, thermal conductivity, strength, hardness, weight, surface state and cost, etc

Advantages of aluminum substrate PCB:

A heat dissipation is significantly better than the standard FR-4 structure.

The dielectric b uses is typically 5 to 10 times the thermal conductivity of conventional epoxy glass and 1/10 of the thickness.

C heat transfer index is more efficient than traditional rigid PCBS. D You may use copper weights lower than those shown on IPC recommended charts. 1. Audio equipment: input amplifier, output amplifier, balance amplifier, audio amplifier, preamplifier, power amplifier, etc. 2. Power supply equipment: switching voltage regulator 'DC/AC converter SW voltage regulator, etc. In general, considering the cost and technical performance, aluminum plate is the ideal choice. There are 6061,5052,1060 aluminum plates available. Copper plate, stainless steel plate, iron plate and silicon steel plate can also be used if higher thermal conductivity, mechanical properties, electrical properties and other special properties are required. 2. Maintenance of the circuit board In use, the circuit board should be maintained regularly to ensure that the circuit board works in a good state and reduce the failure rate of the circuit board

Aluminum substrate structure composition:

1. Circuit layer, circuit layer (generally using electrolytic copper foil) is etched to form printed circuit, used to realize the assembly and connection of devices. With the same thickness and the same line width, the aluminum substrate can carry a higher current than the traditional FR-4.

2. Insulation layer: insulation layer is the core technology of aluminum substrate, mainly playing the function of bonding, insulation and heat conduction. Aluminum substrate insulation layer is the largest thermal barrier in power module structure. The better the thermal conductivity of the insulation layer, the more conducive to the diffusion of heat generated during the operation of the device, the more conducive to reduce the operating temperature of the device, so as to improve the power load of the module, reduce the volume, prolong the life, improve the power output and other purposes. The maintenance of the circuit board in use is divided into the following situations: half a year maintenance: clean the dust on the circuit board every quarter, and clean the dust on the circuit board with a special cleaning liquid. After cleaning the dust on the circuit board, dry the circuit board with a hair dryer.

3. When FPC starts to weld all the pins, add solder to the tip of the soldering iron and apply flux to all the pins to keep them wet. With the soldering iron tip contact chip at the end of each pin, until now see solder into pin high values of thermal conductivity is usually a ceramic, copper, etc., but because of considering the capital of doubt, most now in the market for aluminum plate, aluminum plate thermal conductivity of the corresponding is everybody CARES parameters, the higher the coefficient of thermal conductivity is one of the representative symbol function better. Aluminum substrate is a common metal base copper-clad aluminum substrate, which has good thermal conductivity, electrical insulation and machining function. The e thermal conductivity of aluminum substrate usually has 1.0, 1.5, 2.0, the specific situation depends on the need for goods. During welding, the tip of the soldering iron should be kept parallel with the soldering pin to prevent excessive soldering solder from lap FPC of the smart earphone.

4. After soldering all the pins, wet them with flux to clean the solder. Suck off excess solder where needed to eliminate any short circuits and lap joints. Finally, use tweezers to check for soldering. When finished, remove flux from the circuit board, dip a bristles brush in alcohol and wipe it carefully in the direction of the pins until flux disappears.