Manufacturing requirements for huizhou FPC mobile phone design

1. FPC design and material selection of flexible circuit board  

The first step is important.  If the customer does not embody or specify a substrate, calendered copper should be considered as it has better bending resistance than electrolytic copper.  But base material with adhesive and non-adhesive bending performance and has a relatively large impact, generally speaking, the bending resistance of non-adhesive base material is better than the bending resistance of rubber base material.  

Classification of substrate:  

Copper foil 1.1:  

1.1.1 Calendered copper.  

Calendered copper is the electrolytic cathode copper lake is melted into a strip, after extrusion forming, because of melting, the composition is relatively single and the crystal distribution is uniform.  Because the crystal direction is parallel to the soft plate, it is suitable for high frequency signal transmission.  Calendered copper has better properties than electrolytic copper.  Its thickness is 1/4oz, 1/3oz, 1/2OZ, 1OZ, 2OZ several.  

1.1.2 Electrolytic Copper:  

Electrolytic copper foil is to use the principle of electroplating to deposit copper ions on the rotating smooth cathode drum, and then the copper foil is separated from the cathode roller to get a smooth and hairy copper foil, after surface treatment can be used.  The contact surface between the electrolytic copper foil and the cathode drum is very smooth, but the other side will be rough under the action of high current density due to the contact with the plating solution.  After surface treatment, the rough surface can increase the surface contact area and improve the adhesion to the protective film.  Its thickness is 1/4oz, 1/3oz, 1/2OZ, 1OZ, 2OZ several.  

PI(poly imine), PET(poly ethyl) or GE(glass fiber) is often used.  PI has the best performance and higher price.  The thickness is 1/2mil, 1mil, 2mil.  

1.3 Material selection and collocation for FPC design of flexible circuit board  

Due to the high performance requirements of slide mobile phones, the choice of materials, whether the base material or CVL, should be considered in the direction of "thin".  

1.4 FPC design and layout of flexible circuit board  

1.4.1 FPC Bending Area circuit requirements:  

A) There shall be no through hole in the part to be bent;  

B) Additional protective copper wire should be added to the most sides of the line. If space is insufficient, additional protective copper wire should be added to the inner R corner of the bending part;  

C) The connecting part of the line shall be designed as an arc.  

1.4.2 AirGap Requirements: The bending area shall be stratified and the glue removed to facilitate the dispersion of stress.  The larger the bending area, the better, without affecting assembly.