Dongguan correction of FPC flexible circuit board film deformation method for matters needing attention ​

Notes for correcting positive FPC flexible CIRCUIT board film deformation correlation method:  

1. Positive FPC flexible circuit board pad overlap method:  

Application: graphic line is not too dense, line width and spacing greater than 0.30m.  

Not applicable: especially users of printed circuit board appearance requirements are strict.  

Note: because of overlapping copy, the pad is elliptical.  Overlap copy, line, disk edge halo and deformation.  

2. Positive FPC flexible circuit board change hole position method:  

Application: all layers of film deformation consistent.  This method also applies to film with dense lines.  

Not applicable: film deformation is not uniform, local deformation is especially serious.  

Note: after using programming instrument to lengthen or shorten the hole position, the out-of-tolerance hole position should be reset.  

3. Positive FPC flexible circuit board photography method:  

Application: when the deformation ratio of film length and width is consistent and it is inconvenient to re-drill the test plate, only silver salt film is applied.  

Not applicable: film length and width direction deformation is inconsistent.  

Note: focus should be accurate to prevent line deformation.  Film loss is high, usually, need to be adjusted for several times before obtaining satisfactory circuit graphics.  

4. FPC flexible circuit board splicing method:  

Application: the line is not too dense, each layer of film deformation is not consistent film;  It is especially suitable for the deformation of resistance welding film and multilayer plate power stratum film.  

Not applicable: film with high wire density, line width and spacing less than 0.2mm.  

Note: when cutting, it should be as little as possible to injure the wire and not to injure the pad.  Pay attention to the correctness of the connection when stitching the copy and repairing the version.  

5. Positive FPC flexible circuit board hanging method:  

Apply;  A film that has not been deformed and prevents deformation after copying.  

Not applicable: distorted film.  

Precautions: Hang the film in a ventilated and dark (safe or not) environment to avoid contamination.  Ensure that the temperature and humidity of the hanging place are consistent with that of the working place.