Basic structure of FPC flexible circuit board

The basic structure of FPC/ flexible circuit board is as follows:  

Copper foil: basically divided into electrolytic copper and calendered copper two kinds.  Common thickness is 1oz 1/ 2Oz and 1/3 oz  

Substrate film: common thickness of 1mil and 1/2mil two kinds.  

Glue (additive) : thickness depends on customer requirements.  

Cover Film  

Covering film: used for surface insulation.  Common thicknesses are 1mil and 1/2mil.  

Glue (additive) : thickness depends on customer requirements.  

Release paper: avoid adhesive adhesion to foreign matter before pressing;  Easy to work.  

PI Stiffener Film  

Reinforcing plate: reinforcing the mechanical strength of FPC, convenient surface mounting operation.  Common thicknesses range from 3mil to 9mil.  

Glue (additive) : thickness depends on customer requirements.  

Release paper: avoid adhesive adhesion before pressing.  

EMI: electromagnetic shielding film to protect the circuit board from external interference (strong electromagnetic area or vulnerable area).