FPC technology development direction of Jiangmen flexible circuit board

With the diversification of use and miniaturization, the flexible board FPC used in electronic equipment requires not only high density circuit, but also high performance in a qualitative sense.  Recent changes in FPC circuit density for flexible boards.  

Using the reduction method (etching) can form a conductor pitch of less than 30um single-sided circuit, conductor pitch of less than 50um double-sided PCB circuit has also been practical.  The conduction between the layers of conductors connected to a double-sided or multi-layered circuit  

The pore size is getting smaller and smaller, and now the pore size of 100um or less has reached the mass production scale.  

The possible manufacturing range of high-density circuits based on the manufacturing standpoint.  Based on circuit pitch and on-hole aperture, high-density circuits can be roughly divided into three types:  

(1) Traditional flexible board FPC.  

(2) High density soft board FPC.  

(3) Ultra-high density flexible board FPC.  

In the traditional reduction method, soft plate FPC with a pitch of 150um and a through-hole aperture of 15um has been mass-produced.  Due to the improvement of materials or processing devices, even in the reduction method can be machined line pitch of 30um.  In addition, by  

In the introduction of CO2 laser or chemical etching process, can achieve 50um aperture through hole mass production processing, now the mass production of most of the high-density soft plate FPC is processed by these technologies.  

However, if the pitch is less than 25um and the through-hole diameter is less than 50um, it is difficult to improve the pass rate even if the traditional technology is improved, and new process or new material must be introduced.  The proposed process has a variety of processing methods, but  

The half addition method of electrocasting (sputtering) technology is the most suitable method, not only the basic process is different, but also the use of materials and auxiliary materials are different.  

On the other hand, the progress of FPC bonding technology requires FPC flexible circuit board to have higher reliable performance.  With the high density of the circuit, the performance of flexible FPC has been diversified and high performance  

These performance requirements depend to a large extent on circuit fabrication techniques or materials used.