Meizhou FPC flexible circuit board technology development direction

With the diversification of use and miniaturization, the FPC wiring used in electronic equipment requires high density circuits as well as high performance in a qualitative sense. Nearest FPC row circuit density

Change. Using the reduction method (etching) can form a conductor pitch of less than 30um single-sided circuit, conductor pitch of less than 50um double-sided PCB circuit has also been practical. Connect the double-sided circuit or

The conducting aperture between the conductor layers of multi-layer circuits is also getting smaller and smaller. Now the holes with the conducting aperture below 100um have reached the mass production scale.

The possible manufacturing range of high-density circuits based on the manufacturing standpoint. Based on circuit pitch and on-hole aperture, high-density circuits can be roughly divided into three types:

(1) Traditional FPC wiring.

(2) High-density FPC wiring.

(3) Ultra-high density FPC wiring.

In the traditional reduction method, FPC with a pitch of 150um and a through-hole aperture of 15um has been mass-produced. Due to the improvement of materials or processing devices, 30um can be processed even in the reduction method

Line pitch. In addition, due to the introduction of CO2 laser or chemical etching and other processes, the 50um aperture of the through-hole mass production processing can be achieved, most of the current mass production of high-density FPC lines are

Processed using these techniques.

However, if the pitch is less than 25um and the through-hole diameter is less than 50um, it is difficult to improve the pass rate even if the traditional technology is improved, and new process or new material must be introduced. Now put forward the work

There are various processing methods, but the use of electroforming (sputtering) technology is the most suitable method, not only the basic process is different, and the use of materials and auxiliary materials are also different.

On the other hand, the progress of FPC wiring joint technology requires FPC wiring FPC to have higher reliable performance. With the high density of the circuit, the performance of FPC line has been diversified and high performance

These performance requirements depend largely on the circuitry processing techniques or materials used.