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Foshan soft board production materials

FPC flexible circuit (FPC) is a technology developed in the 1970s in the United States for the development of space rocket technology. It is made of polyester film or polyimide as the base material. It is a highly reliable and excellent flexible printed circuit.  A large number of precision components are embedded in a narrow and limited space to form a flexible circuit.  This kind of circuit can be bent at will, folding light weight, small volume, good heat dissipation, easy installation, break through the traditional interconnection technology.  In the structure of flexible circuit, the materials are insulating film, conductor and adhesive.  

 Multilayer FPC.png

‍ 1. Raw materials  

 

  (1) glue material, no glue material;  The copper on the material is divided into electrolytic copper and calendered copper. The material of non-adhesive calendered copper is flexible and has good foldability.  

 

 (2) Material thickness: PI + copper thickness  

 

 2, pure rubber  

 

 Pure adhesive is mainly used for lamination and lamination of multilayer boards, but also for bonding reinforcement.   

 

3, reinforcement  

  

Reinforcement generally includes the following types: PI reinforcement, PED reinforcement, FR4 reinforcement, steel sheet reinforcement, etc. The thickness of general reinforcement includes PI1/2 1/2, PI11, PI21, PI31 to PI91. The two values after PI respectively represent the thickness of PI and the thickness of glue, and the unit is Mil.  Thickness according to customer requirements.  

 

 4, cover film  

 

The covering film is composed of PI and glue.  

  

5, the membrane closure  

  

Mainly play a signal screen closed function, and to ground.  

 

6, 3 M adhesive  

  

Bonding reinforcement and fixation FPC and other functions.  

 

 

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