Shenzhen FPC flexible circuit board welding procedure

FPC welding procedure is as follows:

1. Before welding, apply flux on the pad and treat it again with the soldering iron to avoid bad tin plating or oxidation on the pad, resulting in bad welding. Chips generally do not need to be treated.

2. Carefully place the PQFP chip on the FPC board with tweezers, taking care not to damage the pins. Align it with the pad, ensuring that the chip is placed in the correct direction. FPC set the temperature of the soldering iron to more than 300 degrees Celsius, dip the tip of the soldering iron tip with a small amount of solder, press down the chip in the aligned position with the tool, add a small amount of flux to the two diagonal positions of the pin, still press down the chip, weld the two diagonal positions of the pin, so that the chip is fixed and cannot move. Recheck chip alignment after soldering diagonal. If necessary, it can be adjusted or removed and re-aligned on the PCB.

3. To begin welding all pins, add solder to the tip of the soldering iron and apply flux to all pins to keep them wet. Touch the end of each chip pin with the tip of the soldering iron until you see the solder flowing into the pin. FPC soldering should keep the tip of the soldering iron parallel with the soldering pin, to prevent excessive solder lap.

4. After soldering all the pins, wet them with flux to clean the solder. Suck off excess solder where needed to eliminate any short circuits and lap joints. Finally, use tweezers to check for virtual welding. When finished, remove the flux from the FPC, dip a stiff brush in alcohol and wipe it carefully in the direction of the pin until the flux disappears.

5. Patch resistance and capacitance components are relatively easy to weld, you can first point tin on a solder spot, and then put on the end of the component, with tweezers to clamp the component, after welding a head, and then see if it is put right; If it is, weld the other end.

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